the web? the web?The pcb cleaning product range stands for a new generation of alkaline surfactant-based cleaning products. The traditional depletion of stencil underside cleaning active ingredients has been considerably reduced in order to achieve decisive advantages over other misprint cleaning surfactant- based Systronic formulations. In addition, Zestron’s cleaning agents offer the following benefits: Product formulations are in full compliance with the latest environmental laws and regulations to offer pcb cleaning safe transport and storage.
Drop in solutions for either existing or new processes, regardless of spray-in-air, ultrasonic, and/or spray-under-immersion based equipment. Cleaning Processes in the stencil underside cleaning Electronics Manufacturing Industry. Zestron has specialized itself on applications Systronic within the electronics misprint cleaning manufacturing market and offers unique pcb cleaningwater based as well as solvent based cleaning process expertise. As part of PCB cleaning applications, Zestron’s can effectively remove all flux residues that might remain from resin and/or rosins, to pcb cleaning residues from lead-based or lead-free formulations, as well as synthetic No-clean fluxes. Additionally, surface preparation for subsequent coating and bonding processes can be achieved on ceramic and FR-4 materials, respectively. Zestron’s process solution approach also guarantees the efficient removal of lead-based and lead-free solder paste formulations, SMT adhesives and thick film pastes from stencils and screens.
Especially for fine pitch applications, process stencil underside cleaning related failures can be significantly reduced and process reliability in turn improved. The objective Systronic for misprint cleaning every SMT printing pcb cleaning equipment is to ensure a consistent print quality at a high throughput rate. A reliable underside wipe cleaning applications can eliminate any process impairment such as solder balling.
Here, Zestron offers water-based as well as solvent-based products derived from the same product technologies. Removing solder paste and/or flux from misprinted, single and double sided assemblies allows for an easy re-integration of boards. This promotes the return on investment idea . Such cleaning processes have also been successfully applied to OSP misprinted products. For chip packaging applications, the removal of contamination from lead frames significantly improves the reliability of subsequent bonding pcb cleaning and molding applications.
So called “Pop Corn” effects can be simply eliminated with solvent and misprint cleaning water-based cleaning processes. As part of Zestron’s maintenance Systronic solutions, the cleaning of solder pallets, misprint cleaning condensation traps, reflow ovens, and dispensing needles can advance the overall production process stencil underside cleaning quality significantly.
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