Additional test substrates were prepared to also take the electrical cleanliness levels into flux residue account. Solder paste and flux were applied on the standard comb structures before glass coupons were placed over the patterns and soldered.
Cleaning agents used Solvent-based cleaning agent and Water-based MPC cleaning agent. Processes used: Immersion assisted by ultrasonic cleaning. Pressurized Hydrex spray under immersion cleaning. Spray in air assisted batch cleaning. High-pressure spray-in-air in-line cleaning. One-chamber solvent-based cleaning. Centrifugal based cleaning HFE-Co-solvent, Immersion assisted SmartSonic by ultrasonic cleaning. Spray in air stencil-cleaning equipment based cleaning. The cleaning agent and processes were combined flux cleaning based flux residue on process figure 6 feasibility. This guaranteed that the product characteristic (i.e. process temperature) and process flux residue specific (i.e. mechanical agitation) parameters were taken into account. The criteria flux remover used for evaluating the results obtained were based on optical, ionic, as well as electrical cleanliness.
An RMA flux-containing paste flux residue was chosen, which would be removable under identical mechanical assistance (Ultrasonic immersion process) with all cleaning agents used during this study. The reference standoff height in this selection flux remover SmartSonic process was 0.004 flux cleaning inches (4MIL). The authors felt, that this would offset any effect that different cleaning media might have on the outcome of this study.
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Ultrasonic cleaning cleaning solvent pcb cleaning aqueous cleaning ultrasonic cleaning systems aqueous cleaning systems flux residue flux residues Dr. Ok. Wack Ultrasonic cleaning equipment Ultrasonic cleaning system